Prof.Dr.Ir.Budiyono, MSi signed a Memorandum of Understanding (MoU) Undip Vocational School with the National Land College (STPN) Yogyakarta on the Implementation of Education, Research and Community Service and Improving the Quality of Human Resources at the Undip Tembalang Vocational School Dean Building , Thursday (3/6).
The signing was carried out by the Dean of the Undip Vocational School, Prof. Dr. Ir. Budiyono, M.Si. with the Chairman of STPN Yogyakarta, Dr. Ir. Senthot Sudirman, M, S. This collaboration with STPN Yogyakarta is an effort of the Undip Vocational School to improve the quality of human resources, especially in the field of spatial planning and land.
The Dean of the Undip Vocational School Prof. Budiyono in his speech said that through this collaboration, it is hoped that information exchange, exchange of facilities can be made to strengthen so that our students graduate on time and are more competent.
not only producing excellent graduates, it is hoped that through this collaboration we can also synergize in the field of research and service from each party to be able to complement each other, collaborate between research teams and or with students.
Meanwhile, the Head of STPN Yogyakarta Dr. Senthot Sudirman was very happy and appreciated the collaboration with the Undip Vocational School with this collaboration we can transfer knowledge to each other between STPN and Undip Vocational School, hopefully this collaboration can bring benefits to both parties.
Present at the signing ceremony were Deputy Dean I of Undip Vocational School Dr. Ida Hayu Dwimawanti, Deputy Dean II of Undip Vocational School Dr. Agus Purwanto, Head of Spatial Planning and Land Planning Study Program Khristiana Dwi Astuti, ST., MT, Manager of Undip Vocational School Srianto, SH, M.Si, while from STPN were also present. Assistant to the III Chair, Ir. Budi Wahyu, Head of the D IV Land Study Program, Dr. Sutaryono, Head of Administration, Drs. Agus Cholil, MM, and the Head of Public Relations and Cooperation, Agus Nugroho, ST, M.Ling.